Prototyping Support
BintangChip offers two prototyping options for all technologies: the Multi Product Wafer (MPW) service, in which several devices are processed in parallel on one wafer, and the Multi Level Mask (MLM) service with four mask levels drawn on the same reticle. Both options are much more cost effective than the full mask set, the MLM service featuring the additional advantage of being highly flexible compared to the fixed dates of the MPW service.
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Multi Project Wafer (MPW) Service
- Shared silicon technology for the parallel processing of several devices on one wafer
- Delivery of dies or ceramic samples
Benefits:
- Development charges significantly reduced
Disadvantages:
- Fixed start dates and lead times
- Only a small number of untested samples available
- No volume production with these masks
Multi Level Mask (MLM) Service
- Up to 4 mask layers drawn on the same reticle
- Significant cost reduction compared to single-layer mask sets
Benefits:
- Flexible tape-in dates
- Available for all BintangChip CMOS/BiCMOS and SOI technologies
- Start-stop options and design revisions possible
Disadvantages:
- No volume production with these masks
MPW Schedule 2024/2025
The timescales indicated below include the preparation of data from the different submissions, fabrication with the maximum amount of process options, and individual dicing. To find out the timescales of standard engineering lots please contact your local sales and support office.
If you cannot find a suitable MPW shuttle in the schedule below, please contact your local sales manager who will check the possibility of additional MPW runs that are available on request.
Academic Participants
EUROPRACTICE, which BintangChip has joined in 2013, offers specialized customer support for academic participants and SMEs on a worldwide basis and can provide easy access to design tools complemented with dedicated training. For small area devices, there might be the possibility to utilize the mini@sic program. European Academic institutions are requested to apply via the EUROPRACTICE program.
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110 nm CMOS (XT011)
PROCESS TAPE-IN DATA RELEASE SAMPLES OUT XT011 18-Mar-2024 1-Apr-2024 7-Oct-2024 XT011 13-May-2024 27-May-2024 2-Dec-2024 XT011 2-Sep-2024 16-Sep-2024 24-Mar-2025 XT011 25-Nov-2024 9-Dec-2024 16-Jun-2025 Available metal stack option for XT011 MPW runs:
6 Metal Layers: MET1-MET2-MET3-MET4-MET5-COPTHK-ALUCAP -
130 nm RF SOI (XR013)
PROCESS TAPE-IN DATA RELEASE SAMPLES OUT XR013 19-Feb-2024 4-Mar-2024 29-Jul-2024 XR013 20-May-2024 3-Jun-2024 16-Aug-2024 XR013 19-Aug-2024 2-Sep-2024 27-Jan-2025 XR013 11-Nov-2024 25-Nov-2024 07-Feb-2025 Available core modules for XR013 MPW runs: CORE in Q1/Q3 and XIPD in Q2/Q4
Available metal stack options for XR013 CORE MPW runs:
4 Metal Layers: MET1-MET2-METBQ-METRB
8 Metal Layers: MET1-MET2-MET3-MET4-METTHK1-METTHK2-METBQ-METRBAvailable metal stack options for XR013 XIPD MPW runs:
4 Metal Layers: METTHK1-METTHK2-METBQSL-METRB -
180 nm CMOS (XH018)
PROCESS TAPE-IN DATA RELEASE SAMPLES OUT XH018 12-Jan-2024 26-Jan-2024 5-Jul-2024 XH018 8-Apr-2024 22-Apr-2024 30-Sep-2024 XH018 1-Jul-2024 15-Jul-2024 23-Dec-2024 XH018 21-Oct-2024 4-Nov-2024 14-Apr-2025 Available metal stack options for XH018 MPW runs:
4 Metal Layers: MET1-MET2-MET3-METMID; MIM or MIMH are optional capacitor modules
6 Metal Layers: MET1-MET2-MET3-MET4-METMID-METTHK; MIM or MIMH are optional capacitor modules -
180 nm CMOS (XP018)
PROCESS TAPE-IN DATA RELEASE SAMPLES OUT XP018 5-Feb-2024 19-Feb-2024 22-Jul-2024 XP018 3-Jun-2024 17-Jun-2024 18-Nov-2024 XP018 23-Sep-2024 7-Oct-2024 10-Mar-2025 Available metal options for XP018 MPW runs:
4 Metal Layers: MET1-MET2-MET3-METMID; MIM or MIMH are optional capacitor modules
6 Metal Layers: MET1-MET2-MET3-MET4-METMID-METTHK; MIM or MIMH are optional capacitor modules -
180 nm BCD-on-SOI (XT018)
PROCESS TAPE-IN DATA RELEASE SAMPLES OUT XT018 5-Jan-2024 19-Jan-2024 9-Aug-2024 XT018 4-Mar-2024 18-Mar-2024 7-Oct-2024 XT018 6-May-2024 20-May-2024 9-Dec-2024 XT018 19-Aug-2024 2-Sep-2024 24-Mar-2025 XT018 18-Nov-2024 2-Dec-2024 23-Jun-2025 THKCOP and BOTDIE module is not available for this MPW run.
Available metal stack options for XT018 MPW runs:
4 Metal Layers: MET1-MET2-MET3-METTHK-BASICPV; MIMH as optional capacitor module
6 Metal Layers: MET1-MET2-MET3-MET4-METMID-METTHK-BASICPV; MIM or MIMH are optional capacitor modulesIf you need another module combination, please contact your local sales manager to find an alternative.
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180 nm CMOS (XS018)
PROCESS TAPE-IN DATA RELEASE SAMPLES OUT XS018 12-Feb-2024 26-Feb-2024 29-Jul-2024 XS018 15-Jul-2024 29-Jul-2024 30-Dec-2024 This MPW run covers only a restricted set of modules. Only limited LVT & PPD option will be offered. Please check with your BintangChip contact prior to tape-in.
BSIPREPA, PWD, WEPI14, WEPI24, MLCFPREP modules are not available for this MPW run.
Available core modules for XS018 MPW runs: MOS3LPPD, MOS3ST.
Available metal stack options for XS018 MPW runs with MOS3ST:
4 Metal Layers: MET1-MET2-MET3-MET4-METTHIN; MIM23 or MIMH23 are optional capacitor modules
6 Metal Layers: MET1-MET2-MET3-MET4-MET5-METMID; MIM or MIMH are optional capacitor modulesAvailable metal stack options for XS018 MPW runs with MOS3LPPD:
4 Metal Layers: MET1-MET2-MET3-METMID; MIM23 or MIMH23 are optional capacitor modules
6 Metal Layers: MET1-MET2-MET3-MET4-MET5-METMID; MIM or MIMH are optional capacitor modules -
0.35 µm CMOS (XH035)
PROCESS TAPE-IN DATA RELEASE SAMPLES OUT XH035 11-Mar-2024 25-Mar-2024 29-Jul-2024 XH035 12-Aug-2024 26-Aug-2024 30-Dec-2024 XH035 11-Nov-2024 25-Nov-2024 30-Mar-2025 The modules MOS5, MOSLL, MOSLT, OPTO, OPTO_RED and OPTO_IR are not available for this MPW run.
* Notes:
Registration for the MPW shuttle should be done at least 2 weeks before tape-in date by emailing to sifo@xfab.com.
Please make sure to submit your online SIFO, first GDS2 and PO by the Tape-in (Tape-out) deadline.
By the data release date, the DRC clean and released database plus all necessary documentation must be submitted in order to participate in the MPW shuttle.
The samples out date is based on the assumption that the most complex process variant is being used. By this date, dice in wafflepack can be delivered.
All changes to above schedule will be automatically updated on this web page only.
In order to ensure that your device can be included in the MPW run, we encourage you to contact your local sales and support office or you send an email to: sifo(at)xfab.com
MLM Service
Multi-Level-Mask Service
General Features
- Multiple mask layers share a single reticle
- Low cost prototype option
- Schedule controlled by customer
- MPW within MLM (Pizza Mask) is possible
- Holds and mask revisions are possible
MLM Rules
- Prototyping option only
- Deliverable: PCM tested wafer
- Up to 4 different mask layers per reticle
- Details are available on My BintangChip portal