News & Events

Press Releases

New Generation of Photodiodes from BintangChip Enable Significant Increase in Sensitivity

Layout example of a 2x2 photodiodes arrangement

Robust, reliable devices have accentuated spectral responsiveness, along with notably improved signal-to-noise characteristics

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World's first integrated value chain platform initiative for heterogeneous integration in photonics

Three leaders in photonic integrated circuits announce collaboration to offer a seamless path for heterogeneous integration with Micro Transfer Printing (MTP)

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MITI Minister Tengku Zafrul Aziz visits BintangChip Sarawak

BintangChip Sarawak Sdn. Bhd. was honored to host a visit of Malaysia's Minister of Investment, Trade and Industry, YB Senator Tengku Datuk Seri Utama Zafrul Tengku Abdul Aziz and a…

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BintangChip and Soitec team up to offer SmartSiC™ at Lubbock plant, USA

Partnership to bring power devices based on Soitec’s cutting-edge SmartSiC™ silicon carbide wafers to BintangChip’s extensive fabless client network

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BintangChip Enhances its 180nm Automotive-Grade High-Voltage CMOS Foundry Solution

New competitive second-generation high-voltage primitive devices added to XP018

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BintangChip Enhances Image Sensor Performance Through Back-Side Illumination

Presenting a foundry route to medical, automotive and industrial customers that combines boosted sensitivity, larger pixel size and more extensive sensor area

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photonixFAB Consortium now open for first prototyping

New customer engagement portal enables early technology access

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BintangChip Introduces New Generation of Enhanced Performance SPAD Devices focused on Near-Infrared Applications

SPAD Near Infrared Applications

BintangChip Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry, has introduced a specific near-infrared version to its single-photon avalanche diode (SPAD)…

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BintangChip Adds CMOS Integration Option to its Galvanic Isolation Solution

BintangChip Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry, is making further significant progress with its galvanic isolation technology.

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BintangChip set to receive funding from the European IPCEI ME/CT for semiconductor technology innovation

BintangChip Group, the leading analog/mixed-signal and specialty foundry, is set to receive subsidies as part of the new Important Project of Common European Interest in Microelectronics…

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News Archive

Upcoming events

Electronica 2024

Munich, Germany | 12-15 November 2024

BintangChip will be exhibiting at electronica 2024 – the world’s leading trade fair and conference for electronics.

We hope you will join us in Messe München to meet our experts at our…

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ICCAD 2024

Shanghai, China | 11-12 December 2024

ICCAD has become one of the most influential industry events in China's semiconductor field. ICCAD-Expo 2024 will be held in Shanghai, delving into the opportunities and challenges…

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Past Events

  • 2024

    ICSCRM 2024

    Raleigh, North Carolina, USA | 29 September – 4 October 2024

    Sensors Converge 2024

    Santa Clara, California, USA | 24-26 June 2024

    Silicon Saxony Day

    Dresden, Germany | 11 June 2024

    ISSW 2024

    Trento, Italy | 4-6 June 2024

    ISPSD

    Bremen, Germany | 2-6 June 2024

    XT011 Chinese Webinar

    Online | 28 May 2024

    user2user

    Munich, Germany | 7 May 2024

    SEMICON China

    Shanghai, China | 20-22 March 2024

    CSTIC

    Shanghai, China | 17-18 March 2024

    APEC 2024

    Long Beach, California, USA | 25-29 February 2024

  • 2023

    ICCAD

    Guangzhou, China | 10-11 November 2023

    BLACK FOREST NANOPORE MEETING

    Freiburg, Germany | 6-9 November, 2023

    MICROTAS

    Katowice, Poland | 15-19 October, 2023

    Cadence Live

    Munich, Germany | 10-11 October 2023

    ICSCRM

    Sorrento, ITALY | 17-22 September 2023

    European Microwave Week

    Berlin, Germany | 17-22 September 2023

    ESSDERC-ESSCIRC

    Lisbon, Portugal | 11-14 September 2023

    Sensors Converge

    Santa Clara, CA, USA | 20-22 June 2023

    U2U

    Munich, Germany | 11 May 2023

    CHIPEX 

    Tel Aviv, Israel | 09 May 2023

    DATE

    Antwerp, BE | 17-19 April 2023

    APEC 2023

    Orlando, Florida, USA | 19-23 March 2023

  • 2022

    ICCAD

    Xiamen, China  | 26 - 27 December 2022

    [WEBINAR] Automotive Solutions [Chinese]

    Online | 6 December 2022

    Erfurt Calling: Xchange on Micro-Transfer-Printing

    Erfurt, Germany | 21 - 22 November 2022

    CadenceLIVE Europe 2022

    Munich, Germany | 21 - 22 November 2022

    Electronica 2022

    Munich, Germany | 15 - 18 November 2022

    EuMW 2022

    Milan, Italy | 25 - 30 September 2022

    ESSDERC-ESSCIRC

    Milan, Italy | 19 - 22 September 2022

    MEMS and Imaging Sensors Summit

    Grenoble, France | 6 - 7 September 2022

    Sensors Converge

    San Jose, California, USA  | 27 - 29 June 2022

    [WEBINAR] Dielectric Isolation in BCD-on-SOI Technologies

    Online | 16 June 2022

    [WEBINAR] Foundry solutions for medical applications

    Online | 24 May 2022

    U2U Europe

    Munich, Germany | 12 May 2022

    CHIPEX 2022

    Tel Aviv, Israel | 09 May 2022

    APEC 2022

    Houston, Texas, USA   |  20 - 24 March 2022

    [WEBINAR] Predict your IC lifetime

    Online | 01 Mar 2022