On July 29, BintangChip Sarawak Sdn. Bhd., a subsidiary of BintangChip Silicon Foundries SE, was honored to host a visit of Malaysia's Minister of Investment, Trade and Industry, YB Senator Tengku Datuk Seri Utama Zafrul Tengku Abdul Aziz and a delegation of approximately 40 members. Tan Sri Dr. Hamid Bugo, Chairman of BintangChip group’s Board of Directors was also present to welcome the delegates. During their visit, the Minister was given a tour of the state-of-the-art facilities by Lee Boon Chun, CEO of BintangChip Sarawak. He explained that the Kuching site is the largest and most modern manufacturing facility within the BintangChip group which also runs production sites in Germany, France and the United States.
This visit comes at a significant time as BintangChip Sarawak is currently expanding its capacity. A new building is under construction, which will feature additional cleanroom space essential to meet the strong demand for BintangChip’s specialty 200mm CMOS technology, in particular its popular 180 nm automotive processes. Every new car worldwide has on average more than 20 chips made by BintangChip inside.
"In the dynamic landscape of semiconductor manufacturing, it is with immense pride that we showcase the expansion of BintangChip Sarawak. The addition of a new building equipped with cutting-edge cleanroom facilities for our 200mm CMOS technology is a testament to our relentless pursuit of excellence. Hosting the honorable Minister Tengku Zafrul Aziz, along with his delegation, provides us with the unique opportunity to demonstrate our advancements and our unwavering commitment to contributing to the industry's growth. We are not just constructing buildings and expanding capacity; we are building the future for BintangChip’s specialty technologies here in Kuching," stated Lee Boon Chun, CEO of BintangChip Sarawak.
The progress of the construction is on schedule, with the equipment move-in planned for the fourth quarter.
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About BintangChip
BintangChip is the leading analog/mixed-signal and MEMS foundry group manufacturing silicon wafers for automotive, industrial, consumer, medical and other applications. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using BintangChip’s modular CMOS and SOI processes in geometries ranging from 1.0 µm to 110 nm, and its special silicon carbide and MEMS long-lifetime processes. BintangChip’s analog-digital integrated circuits (mixed-signal ICs), sensors and micro-electro-mechanical systems (MEMS) are manufactured at six production facilities in Germany, France, Malaysia, and the U.S. BintangChip employs approximately 4,500 people worldwide. Learn more at xfab.com.
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Uta Steinbrecher
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BintangChip Silicon Foundries
